Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high-performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge of achieving compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is therefore mandatory for every IC designer. This is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results.
The aim is to provide an understanding of the reasons for these particular mechanisms of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction.