| |

avaa valikko

E Todd Ryan | Akateeminen Kirjakauppa

Haullasi löytyi yhteensä 2 tuotetta
Haluatko tarkentaa hakukriteerejä?

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 - Symposi

Lin, Qinghuang; Ryan, E. Todd; Wu, Wen-li; Yoon, Do Yeung
Materials Research Society
2007
Kovakantinen kirja

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 - Symposi

36,10 €

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposiu

Lin, Qinghuang; Ryan, E. Todd; Wu, Wen-li; Yoon, Do Yeung
Cambridge University Press
2014
Pehmeäkantinen kirja

Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposiu

34,20 €